"Tech Talk" for Techies
Tech Talk for Techies - New to Advanced Circuits!!!
Click Here for Vol. 1 - "Via interconnect Holes" - August 2012
Click Here for Vol. 2 - "Via In Pad - Conductive Fill or Non-Conductive Fill?" - November 2012
Click Here for Vol. 3 - "Highly Reliable Via-In-Pad Design" - February 2013
Click Here for Vol. 4 - "Beyond FR-4: High Performance Materials for Advanced Designs" - Click Here to view Don Carron's Most Recent Advanced Technologies Materials Matrix.
