Made in the USA

Expanded PCB Board Capabilities

Advanced Manufacturing Capabilities to Meet Your Unique Product Demands and Design Criteria

 Buried Chip Resistors
 Blind and Buried Vias
 Up to 40 layers
 .0025" Trace/Space
 Air Pockets between layers
 Via-in-Pad
 Cavity Boards
 DOD Contracts
 Stacked Microvias
 Laser Drilled Microvias (HDI)
 Laser Direct Imaging (LDI)
 Down to .3mm Pitch
 Heavy Copper (up to 20 oz.)
 Multilayer RF Designs (up to 8 layers)
 Oversized Boards (up to 37" x 120")
 ITAR Registered

 

 

 

As an Advanced Circuits customer, you can depend on our multiple divisions with broad based technical expertise that has enabled us to fabricate specialized printed circuit boards for all markets. We can manufacture PCB boards with unique product demands to meet your design criteria. Our expanded PCB capabilities range from laser drilled microvias, cavity boards, heavy copper, via-in-pad, and much more.

We serve the military, medical, aeronautical, and commercial PCB industry, and are one of the only facilities in the U.S. that is able to manufacture for DOD Contracts.

PCB expanded capabilities Advanced Circuits Printed Circuit Boards Help

New Advanced Circuits PCB Board Materials!

These new materials can be utilized for: Integrity Designs requiring miniaturization, Advanced HDI, Stacked Microvias, Antenna and Aerospace, Multilayer Advanced RF and Microwave. Advanced Circuits is one of the select few fabricators in the United States certified to offer Integral Technology's Zeta Lam high density interconnect product.

  • Rogers 2929 Bondply
  • 3M ECM (Embedded Capacitance Material) - Click Here for more info
  • ROHACELL
  • Zeta Lam SE - Click Here for more info

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