Made in the USA

Expanded PCB Board Capabilities

Advanced Manufacturing Capabilities to Meet Your Unique Product Demands and Design Criteria

Printed Circuit Board Buried Chip Resistors  Buried Chip Resistors
Printed Circuit Board blind & buried vias Blind and Buried Vias
Printed Circuit Board 1-40 layers Up to 40 layers
Printed Circuit Board trace space .0025" Trace/Space
Printed Circuit Board air pockets Air Pockets between layers
Printed Circuit Board via in pad Via-in-Pad
Printed Circuit Board cavity boards Cavity Boards
Printed Circuit Board DOD contracts DOD Contracts
Printed Circuit Board stacked microvias Stacked Microvias
Printed Circuit Board laser drilled microvias Laser Drilled Microvias (HDI)
Printed Circuit Board laser direct imaging Laser Direct Imaging (LDI)
Printed Circuit Board pitch Down to .3mm Pitch
Printed Circuit Board heavy copper Heavy Copper (up to 20 oz.)
Printed Circuit Board multilayer  RF designs Multilayer RF Designs (up to 8 layers)
Printed Circuit Board over sized boards Oversized Boards (up to 37" x 120")
Printed Circuit Board ITAR registered ITAR Registered




As an Advanced Circuits customer, you can depend on our multiple divisions with broad based technical expertise that has enabled us to fabricate specialized printed circuit boards for all markets. We can manufacture PCB boards with unique product demands to meet your design criteria. Our expanded PCB capabilities range from laser drilled microvias, cavity boards, heavy copper, via-in-pad, and much more.

We serve the military, medical, aeronautical, and commercial PCB industry, and are one of the only facilities in the U.S. that is able to manufacture for DOD Contracts.

PCB capabilities Advanced Circuits Printed Circuit Boards

New Advanced Circuits PCB Board Materials!

These new materials can be utilized for: Integrity Designs requiring miniaturization, Advanced HDI, Stacked Microvias, Antenna and Aerospace, Multilayer Advanced RF and Microwave. Advanced Circuits is one of the select few fabricators in the United States certified to offer Integral Technology's Zeta Lam high density interconnect product.

  • Rogers 2929 Bondply
  • 3M ECM (Embedded Capacitance Material) - Click Here for more info
  • Zeta Lam SE - Click Here for more info


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