Multiple divisions with broad based technical expertise enable Advanced Circuits to create special products for all markets. We can supply boards with unique product demands to meet your design criteria.
- Buried Chip Resistors
- Blind and Buried Vias
- Up to 40 layers
- .0025" Trace/Space
- Air Pockets between layers
- Cavity Boards
- Stacked Microvias
- Laser Drilled Microvias (HDI)
- Laser Direct Imaging (LDI)
- Down to .3mm Pitch
- Heavy Copper (up to 20 oz.)
- Multilayer RF Designs (up to 8 layers)
- Oversized Boards (up to 37" x 120")
New Advanced Circuits PCB Board Materials!
These new materials can be utilized for: Integrity Designs requiring miniaturization, Advanced HDI, Stacked Microvias, Antenna and Aerospace, Multilayer Advanced RF and Microwave. Advanced Circuits is one of the select few fabricators in the United States certified to offer Integral Technology's Zeta Lam high density interconnect product.