Expanded PCB Board Capabilities!
Multiple divisions with broad based technical expertise enable Advanced Circuits to create special products for all markets. We can supply boards with unique product demands to meet your design criteria.
|• Up to 40 layers||• Laser Drilled Microvias (HDI)|
• .0025" Trace/Space
|• Laser Direct Imaging (LDI)|
|• Air Pockets between layers||• Stacked Microvias|
|• Via-in-Pad||• Down to .3mm Pitch|
|• Cavity Boards||• Heavy Copper (up to 20 oz.)|
|• Buried Chip Resistors||• Multilayer RF Designs (up to 8 layers)|
|• Oversized Boards (up to 37" x 120")||• Blind and Buried Vias|
New Advanced Circuits PCB Board Materials!
These new materials can be utilized for: Integrity Designs requiring miniaturization, Advanced HDI, Stacked Microvias, Antenna and Aerospace, Multilayer Advanced RF and Microwave. Advanced Circuits is one of the select few fabricators in the United States certified to offer Integral Technology's Zeta Lam high density interconnect product.
|• Rogers 2929 Bondply|
|• 3M ECM (Embedded Capacitance Material) - Click Here for more info|
|• Zeta Lam SE - Click Here for more info|