Made in the USA

Advanced Circuits Capabilities

NEW Microvia HDI Capabilities!

 

     
  Standard Advanced
Total Pad Size    
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single and double deep Yes Yes
Type II Capabilities buried vias with microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:1
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1

Click Here to download our complete list of Capabilities

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