Advanced Circuits, Inc. (ACI)

As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more. Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics in the general news media as they relate to printed circuit board technology.

Have an idea for a blog topic you would like us to cover? Get in touch with us

HDI PCB Capabilities from Advanced Circuits

Advanced Circuits is the ideal printed circuit board manufacturer for your HDI PCB (High Density Interconnect Printed Circuit Board) requirements.  Since 1989, the company has been known as an industry leader for its quality, precision, and on-time reliability.  With recent acquisitions, Advanced Circuits has expanded its printed circuit board manufacturing capabilities to include some of the most advanced and powerful PCB solutions that range from the simplest designs to the most rigorous requirements for the medical, commercial, defense, and aerospace marketplace.

Advanced Circuits also offers in-house PCB assembly service for quickturn prototype quantities, making turnkey HDI PCB assembly an easy and seamless process.  Our printed circuit board assembly service is North America’s leading one-stop solution for PCB and assembly under one roof supporting Ball Grid Arrays (BGA) as small as .35mm pitch (all BGAs are x-ray inspected), fine pitch components as small as 15 mil pitch, and passive components as small as 0201 with design review.  We can provide low-cost first article builds and have no minimum order requirements.


Advanced Technology for HDI PCB Fabrication

You can rely on Advanced Circuits state-of-the-art equipment and experience in cutting-edge precision work for your most rigorous HDI PCB requirements.  We can achieve the highest quality with in-house laser drill capabilities that include precise depth control.  Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.  Our advanced circuit board manufacturing capabilities include:

  • Buried Chip Resistors
  • Blind and Buried Vias
  • Stacked Microvias
  • Laser Drilled Microvias
  • Up to 40 layers
  • Laser Direct Imaging (LDI)
  • .00275″ Trace/Space
  • Down to .3mm Pitch
  • Air Pockets between layers
  • Via-in-Pad
  • Multilayer RF Designs
  • Cavity Boards
  • Advanced PCB Laminate/Material Options

For a complete list of PCB fabrication capabilities, click here.

Advanced Circuits HDI PCB Specifications

Total Pad Size Typical Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:1
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1


This entry was posted in Expanded Capabilities, HDI PCB, Printed Circuit Boards and tagged , , , , , . Bookmark the permalink.

Comments are closed.