Application Drivers for Flexible Circuit

• Reduction in package size required
• Reduction in package weight sought
• Decrease in assembly time sought
• Need to reduce assembly costs
• Requirement for assembly error reduction
• Increased system reliability sought
• More than 25 point to point wire needed
• Dynamic flexure of circuitry required
• Controlled impedance signal transmission required
• Lower inductance cabling needed
• Improved heat dissipation capability
• Airflow improvement inside "box" required
• 3-Dimensional packaging scheme sought
• Compliant substrate for surface mounting
• Desire to improve product appearance