Description

Preferred

Standard

Number of Layers

1 to 12

12 to 24

Thickness Tolerance

+/- 10%

+/- 8%

Trace Width (mils) - 0.5 oz Copper

5 and above

3 to 4

Trace Width (mils) - 1.0 oz Copper

8 and above

5 to 7

Smallest Hole Size -Mech. Drilled

10 mils

8 mils

Smallest Hole Size -Laser Drilled

4 mils

2 mils

Aspect Ratio - PTH

6:1 or Less

Up to 10:1

Aspect Ratio - Blind Microvia

0.5:1

0.75:1

SMT Pitch (mils)

Over 14

6 to 14

Impedance Control Tolerance

+/- 15%

+/- 10 %

Min. Pad Size - Int. (mils)

FHS + 22

FHS + 18

Min. Anti Pad Size (mils)

FHS + 32

FHS + 26

Min. Pad Size - Button Plate (mils)

FHS + 25

FHS + 20

Min. Pad Size - Pattern Plate (mils)

FHS + 22

FHS + 18

Min. Soldermask Clearance

8 mils

6 mils

Min. Soldermask Webbing

8 mils

6 mils

Min. Coverfilm Webbing

14 mils

10 mils

Covercoat Type

Coverfilm

Flex LPI

Allowable Squeezeout per Side

5 mils/mil

3 mils/mil

Trace Geometry

Curved

45 degrees

"I-Beam" Traces

None

Minimal

Grain Direction

Specified

Longitudinal

Ground Plane

Cross-hatched

Perforation

Strain Relief

Yes

Yes

Inside Corner

Wide Radius

Radius

Construction Material

Balanced

Mixed

Bend Radius

Over 18x

10x to 18x